Fujitsu Develops World’s First Carbon Nanotube adhesive Sheet that Exhibits Extremely High Thermal Conductivity

Fujitsu today announced the development of the world’s first adhesive sheet composed of carbon nanotubes with extremely high thermal conductivity of up to 100 W/mK (watt per meter per Kelvin). Carbon nanotubes have high thermal conductivity and represent a promising candidate for heat dissipation from heat sources including semiconductor devices. The material remains difficult to handle due to its fragility, rendering it impractical for many purposes. To address this, Fujitsu has successfully developed a technology for laminating vertically aligned carbon nanotubes, while maintaining their original characteristics of high thermal conductivity and flexibility, as well as a technology for bonding them with sufficient adhesion.

This technology facilitates the cutting and handling of
carbon nanotube sheets, making it possible to use them as a heat dissipation
material, for example, in automotive power modules for electric vehicles (EVs).
The newly developed carbon nanotube adhesive sheet has thermal conductivity of
up to 3 times that of the conventional indium heat dissipation material, which
is known as a high thermal conductivity material, compared with measured values
including interface resistance. Since the sheet is laminated with adhesive and
protective layers, it can be easily cut and handled, and can be used for
applications requiring adhesion.  This technology
will make it possible to put carbon nanotubes into practical use as heat dissipating
materials, including in automotive power modules for EVs.




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